本文来自“COMSOL”，文章仅代表作者观点，与“环球科学科研圈”无关。 COMSOL 多物理场仿真软件的最新版本带来了 “放电模块”、GPU 加速，以及全面提升软件性能的一系列更新。 COMSOL 于 2024 年 11 月 19 日发布了 COMSOL Multiphysics® 6.3 版本。新版本带来了众多 ...

The COMSOL Multiphysics® modelling and simulation software is used in all fields of engineering, manufacturing and scientific ...

COMSOL 多物理场仿真软件的最新版本带来全新的代理模型功能和更快的求解器技术。 美国马萨诸塞州，伯灵顿（2023 年 11 月 7 日）——业界领先的多物理场仿真软件和解决方案提供商 COMSOL 公司发布了 COMSOL Multiphysics ® 6.2 版本，新增的数据驱动代理模型为 ...

先进封装已成为半导体行业延续摩尔定律的关键技术。相较于传统芯片制造过程，先进封装通过整合多芯片和制程，将多个半导体组件进行集成，用于提升系统性能，从而更好地应对半导体关键技术和商业化地束缚。先进封装同时对制造过程中的不同工艺提出了 ...

COMSOL Multiphysics® version 6.4 introduces new and updated functionality as well as the new Granular Flow Module, based on the discrete element method (DEM), for simulating grain and powder flow. The ...

随着半导体制造工艺节点的不断推进，制程复杂度和精度要求日益提升。半导体制程中涉及大量复杂的物理过程，对这些过程的精准控制直接影响芯片性能和制程稳定性。传统的试验和测试方法难以满足对半导体产品性能、良率以及可靠性的高要求。多物理场 ...

Capacitive sensing is used in many applications, including proximity, pressure, displacement, position, and acceleration sensors. Predicting the real-world performance of capacitive devices, including ...

Many technologies rely on electric discharge phenomena, including consumer electronics, medical devices, and high-voltage power systems. During product development, it is highly beneficial to simulate ...

全新发布的COMSOL Multiphysics和COMSOL Server产品为数值仿真专业人员提供了行业领先的集成式CAE软件环境，用于创建多物理场模型和构建仿真App应用程序，实现了仿真App在世界各地的合作者与客户之间的轻松部署。 广告 COMSOL 公司作为领先的多物理场建模、仿真和 ...

The Particle Tracing Module extends the functionality of the COMSOL Multiphysics environment for computing the trajectory of particles in fluids and electromagnetic fields, including particle-particle ...

On 19 September, 2018, COMSOL will be hosting a free-to-join, 18-minute webinar, introducing attendees to modelling photodiodes in the COMSOL Multiphysics software. To accurately model the ...