The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...
SINGAPORE — ST Assembly Test Services Ltd. this week announced availability of a thinner version of its small-thin plastic ball-grid array (STPBGA) package, which reduces the height to 1.2 mm compared ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results