Heatsink technology has rapidly improved over the last few years. The introduction of heatpipes, use of large radius fans and the sophisticated mounting mechanisms have all aided these developments.

Hyundai-Kia America Technical Center (HATCI) and Forward Engineering North America LLC recently worked together to design a new method of testing thermal runaway performance in composite materials for ...

Due to their light weight and optimal mechanical properties, modern composite materials, such as carbon fiber-reinforced polymers (CFRP), are increasingly used in automotive, wind energy and ...

Increasingly complex and heterogeneous architectures, coupled with the adoption of high-performance materials, are making it much more difficult to identify and test for thermal issues in advanced ...

Over the years, standards organizations have undertaken numerous efforts to standardize the test methods that are used to characterize the thermal performance of semiconductor devices. Groups such as ...

As the transistor density and switching speed of integrated circuits (ICs) increase and the package size decreases, the emerging generation of high-power ICs requires thermal management during testing ...

Are your environmental test results exposing true device weaknesses, or just reflecting extreme stress conditions?

Not long ago I had a conversation with a thermal engineer who was using a phase change pad as the thermal interface material (TIM) in a certain device. Some of the devices failed pre-maturely due to ...