Abstract: Hybrid wafer bonding is a key technology for enabling fine-pitch 3D integration, yet its quality remains highly sensitive to wafer warpage and misalignment. This study develops a 3D finite ...

Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...

As OEMs expand EV platforms and 800V architectures, SiC content per vehicle rises, directly lifting wafer processing demand across substrates and epi wafers. 2) Grid modernization and renewable ...

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Demonstrates 300mm technology, enabling scalable platforms for AI, AR/VR, and advanced power devices Wolfspeed has announced a significant industry milestone with the successful demonstration of a ...

Recent market reports highlight ongoing challenges for TSMC's wafer fabs in Arizona, including high costs and low profits. Industry sources cite supply chain issues, talent shortages, equipment ...

Daily Stream Follow me! My server Discord! #geometrydash #deluxe12 New York tourist stabbed while changing baby’s diaper in Macy’s restroom: Police Is photo of Donald Trump using a walker real? What ...

The Wafer Processing Equipment Market is poised for remarkable expansion, projected to grow from USD 5.4 billion in 2025 to USD 10 billion by 2035, representing a CAGR of 6.3%. This growth trajectory ...

Rapidus Corp., a Tokyo-based chip manufacturing startup, reportedly plans to build a fab capable of making 1.4-nanometer processors. Nikkei Asia reported the initiative today. The fab could create ...